Highness Microelectronics Ltd.
HIGHNESSSME
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Overview
Highness Microelectronics Limited is an ISO 9001:2015 and ISO 13485:2016 certified company specializing in the design, development, integration, assembly, and manufacture of digital-imaging solutions. The company operates through two primary business categories: 'Off the Shelf Products,' which includes TFT and LCD modules, display controllers, touch screens, and display enhancement solutions; and 'Market Specific Solutions/Project,' which provides customized display monitors like open-frame, panel-mount, industrial-grade, and medical-grade displays. Highness Microelectronics serves key industry verticals, including Industrial Automation, Medical & Healthcare, Railways, and Defence & Aerospace.
Opening Date
Mar 24, 2026
Closing Date
Mar 27, 2026
Listing Date
Apr 02, 2026
IPO Type
SME
IPO Status
Closed
Issue Size
21.67 Cr
Fresh Issue
19.84 Cr
Offer for Sale
1.83 Cr
Price Band
₹114 - ₹120
Lot Size
1200
IPO Timeline
Financials
Revenue
Profit After Tax (PAT)
IPO Objective
The main objectives of the issue are to utilize the net proceeds from the Fresh Offer for the following purposes:
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Funding capital expenditure of approximately ₹5.27 crores towards setting up a new COG (Chip on Glass) and FOG (Film on Glass) assembly line at the factory in Rabale, Mumbai, to facilitate the in-house manufacturing of Open-Cell modules and advance the company's backward integration strategy.
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Funding the working capital requirements of the company with an allocation of approximately ₹6.71 crores to support increased operational needs arising from business expansion, sourcing of raw materials, and managing receivables.
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Repayment and/or pre-payment, in full or part, of existing borrowings availed by the company, amounting to approximately ₹1.89 crores, which will help reduce debt servicing costs and improve the debt-equity ratio.
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Allocating the remaining funds for general corporate purposes, which may include strategic initiatives, brand building, and other operational needs to support business growth.
Key Performance Indicator
P/E Ratio
16.7
EPS
7.19
ROE
40.97%
ROCE
36.88%
RONW
40.97%
Debt to Equity Ratio
—
PAT Margin
23.67%
EBITDA Margin
39.26%
P/B
4.2
SWOT Analysis
Strengths
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Holds ISO 9001:2015 and ISO 13485:2016 certifications, ensuring high-quality standards in manufacturing processes and products.
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Possesses strong customization expertise, allowing the development of products tailored to the specific technical needs of Original Equipment Manufacturer (OEM) customers.
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Maintains a strong and loyal customer base, fostering repeat business and a competitive advantage in attracting new clients.
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Specializes in developing durable, weather-resistant display solutions designed to perform reliably in harsh environmental conditions.
Weaknesses
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Dependence on third-party suppliers for certain components and processes, which can pose supply chain risks.
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Projects often have a long gestation period, which can affect revenue cycles and financial planning.
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Risk of failure to attract and retain skilled technical and managerial personnel crucial for growth and innovation.
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Business operations are vulnerable to potential disruptions in manufacturing facilities, which could impact production and delivery schedules.
Opportunities
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Increasing interest from international companies seeking local partners for 'Make in India' initiatives, creating collaboration opportunities.
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Growing government and private sector spending in the healthcare industry is driving demand for specialized medical-grade displays.
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The push for localization across various industries provides a significant market for domestically manufactured display solutions.
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Government incentives and policies, such as the Production-Linked Incentive (PLI) schemes, support domestic electronics manufacturing and reduce operational costs.
Threats
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Potential changes in government policies and regulations could adversely affect business operations and financial performance.
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Delays in the realization of government incentives could impact financial planning and project timelines.
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Competition from low-cost Chinese products entering the Indian market poses a threat to market share and pricing power.
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Vulnerability to disruptions in the supply chain or significant increases in the prices of critical raw materials.
Subscription Rate
Frequently Asked Questions about Highness Microelectronics Ltd.
Highness Microelectronics Limited is an ISO 9001:2015 and ISO 13485:2016 certified company specializing in the design, development, integration, assembly, and manufacture of digital-imaging solutions. The company operates through two primary business categories: 'Off the Shelf Products,' which includes TFT and LCD modules, display controllers, touch screens, and display enhancement solutions; and 'Market Specific Solutions/Project,' which provides customized display monitors like open-frame, panel-mount, industrial-grade, and medical-grade displays. Highness Microelectronics serves key industry verticals, including Industrial Automation, Medical & Healthcare, Railways, and Defence & Aerospace.
The Highness Microelectronics Ltd. IPO is scheduled to open for subscription on Mar 24, 2026 and close on Mar 27, 2026. Investors can apply for shares during this period through eligible platforms.
The price band for the Highness Microelectronics Ltd. IPO is ₹114 to ₹120. Investors can place bids within this range once the issue opens.
The minimum lot size for the Highness Microelectronics Ltd. IPO is 1200 shares. The minimum investment amount ₹1,44,000.
The total issue size of the Highness Microelectronics Ltd. IPO is approximately ₹21.67. Issue size represents the total value of shares offered to the public.
As per the latest available information, the Highness Microelectronics Ltd. IPO has been subscribed 8.67 times. Subscription levels can change significantly during the offer period.
The Grey Market Premium (GMP) for the Highness Microelectronics Ltd. IPO is not available as of now. GMP reflects unofficial market sentiment and should not be considered a guarantee of listing performance.
The shares of Highness Microelectronics Ltd. are expected to list on stock exchanges on Apr 02, 2026, subject to completion of the allotment process and regulatory approvals.
The net proceeds from the Highness Microelectronics Ltd. IPO are proposed to be used for The main objectives of the issue are to utilize the net proceeds from the Fresh Offer for the following purposes:, Funding capital expenditure of approximately ₹5.27 crores towards setting up a new COG (Chip on Glass) and FOG (Film on Glass) assembly line at the factory in Rabale, Mumbai, to facilitate the in-house manufacturing of Open-Cell modules and advance the company's backward integration strategy., Funding the working capital requirements of the company with an allocation of approximately ₹6.71 crores to support increased operational needs arising from business expansion, sourcing of raw materials, and managing receivables., Repayment and/or pre-payment, in full or part, of existing borrowings availed by the company, amounting to approximately ₹1.89 crores, which will help reduce debt servicing costs and improve the debt-equity ratio., Allocating the remaining funds for general corporate purposes, which may include strategic initiatives, brand building, and other operational needs to support business growth.
Before applying for the Highness Microelectronics Ltd. IPO, investors generally review the company’s business model, financial performance, valuation, industry outlook, and risk factors mentioned in the offer document.
