ASML–Tata MoU backs India’s first 300mm fab (2026)

MoU signing in The Hague during Modi’s Netherlands visit

Tata Electronics and Dutch semiconductor equipment company ASML signed a Memorandum of Understanding (MoU) during Prime Minister Narendra Modi’s visit to the Netherlands. The signing took place in The Hague and was witnessed by PM Modi and Prime Minister of Netherlands Rob Jetten, as stated in the event description shared with the announcement. The timing matters because the agreement was positioned as part of a broader push to deepen Indo-Dutch cooperation in critical technologies. Semiconductors were presented as a clear priority area during the visit, alongside other sectors.

The MoU links directly to Tata Electronics’ plan to build what the companies describe as India’s first commercial 300 mm (12-inch) semiconductor wafer fabrication plant. In a joint statement, the companies said the collaboration will support the establishment and ramp-up of the upcoming facility at Dholera in Gujarat. ASML is globally critical to chipmaking because lithography equipment is a central bottleneck in advanced semiconductor manufacturing.

What Tata Electronics and ASML agreed to do

The partnership is framed around enabling Tata Electronics to establish and successfully ramp its 300 mm fab at Dholera. According to the joint statement, the collaboration will focus on deploying ASML’s “holistic suite” of advanced lithography tools and solutions at the Dholera facility. The companies said ASML’s industry-leading technologies are expected to help ensure seamless operations at India’s first commercial 300 mm semiconductor fab.

ASML will provide support across “products, technology, and people,” according to CEO Christophe Foquet’s comments made after the MoU signing. He said semiconductors have become a clear priority for India and described Tata as the company set to build the country’s first semiconductor fab. Foquet also said ASML wants to provide Tata with the “very best lithography solutions” for the first fab.

Why lithography support is central to the Dholera plan

Lithography tools determine how chip patterns are transferred onto wafers, making them foundational to fab performance and yield. In the company statement, ASML’s role is anchored specifically in deploying its lithography tools and solutions at Dholera. The companies also highlighted that the collaboration is expected to deliver value to Tata Electronics’ customers by enabling reliable operations.

The MoU also outlines capability building beyond machinery. The partnership will focus on accelerating training of local talent, developing lithography-intensive skills, strengthening supply chain resilience, and creating research and development infrastructure needed for the long-term success of India’s first fab. For India’s semiconductor ambition, these elements address constraints that typically slow new fab ramp-ups: skilled workforce availability, equipment readiness, and dependable vendor networks.

Project scale: 300 mm fab with ₹91,000 crore investment

Tata Electronics is setting up the semiconductor fabrication facility with an investment of ₹91,000 crore, which is also described as around $11 billion in the provided material. The plant is planned as a 300 mm (12-inch) facility, the standard wafer size for modern high-volume chip manufacturing. The companies described the project as a key part of India’s push to build a domestic semiconductor ecosystem and reduce dependence on imports.

The Dholera facility is intended to manufacture chips for sectors including automotive, mobile devices, artificial intelligence (AI), and other high-growth segments for global customers. While the announcement does not provide timelines or capacity targets, it frames the facility as commercially significant because it is expected to be India’s first commercial 300 mm semiconductor fabrication plant.

How this fits India’s broader semiconductor mission

The MoU was repeatedly linked to India’s wider semiconductor goals. The announcement material states that the partnership supports India’s ambition to build a domestic semiconductor ecosystem and reduce reliance on imports. It also ties the agreement to strategic Indo-Dutch collaboration in critical technologies, explicitly naming semiconductor technology.

In a post on X referenced in the supplied text, PM Modi said the collaboration would strengthen cooperation in “futuristic sectors” and support India’s growing semiconductor ambitions. Separately, while speaking to business leaders during the visit, Modi invited Dutch companies to explore opportunities in India, naming semiconductors alongside maritime, renewable energy, digital technologies, artificial intelligence, and healthcare.

Tata’s parallel tie-up with Taiwan’s PSMC

The Dholera fab plan also includes a separate partnership. Tata Electronics has partnered with Taiwan-based Powerchip Semiconductor Manufacturing Corporation (PSMC), gaining access to a broad portfolio of semiconductor technologies including 28nm, 40nm, 55nm, 90nm and 110nm process nodes. This detail is relevant because it indicates the technology set that Tata is positioning for the fab’s early manufacturing roadmap.

Together, the ASML MoU and the PSMC partnership show a multi-part buildout approach: equipment and lithography enablement on one side, and process technology access on the other. The provided material positions these partnerships as steps in building out the full semiconductor ecosystem including equipment, process and design technology, and materials.

What the companies said about execution and talent

Tata Electronics CEO and MD Randhir Thakur said ASML’s expertise in holistic lithography solutions will help ensure the timely ramp of the Dholera fab, create a resilient and trusted supply chain for global customers, drive innovation, and develop talent locally. On ASML’s side, CEO Christophe Foquet emphasised support through products, technology, and people.

Both sides also highlighted domestic capability creation. The statement notes cooperation to develop domestic talent, strengthen supply chains, and build research initiatives and R&D infrastructure critical for long-term success. The emphasis on lithography-intensive skills signals that the partnership is not limited to tool delivery but extends to operational readiness.

Key facts at a glance

Market impact: what changes for India’s semiconductor ecosystem

The announcement strengthens the credibility of India’s first commercial 300 mm fab plan by linking it with a major global lithography supplier. For investors tracking India’s semiconductor manufacturing theme, the partnership highlights that equipment enablement and ramp-up support are being addressed alongside talent and supply chain development.

The agreement also underscores India’s approach of combining domestic capex with international technology partnerships. The text notes that ASML’s largest markets include South Korea, Taiwan and China, and that the agreement opens a new market for ASML. For India, the partnership aligns with the government’s stated goal of emerging as a major global semiconductor manufacturing hub by 2032, as cited in the supplied material.

Conclusion

Tata Electronics and ASML’s MoU, signed during PM Modi’s Netherlands visit, sets out a framework to deploy ASML’s lithography tools and support the establishment and ramp-up of Tata’s 300 mm Dholera fab in Gujarat. Along with focus areas like training, R&D infrastructure, and supply chain resilience, the agreement positions Dholera as a central project in India’s domestic semiconductor ecosystem push. Next milestones will depend on how the partnership translates into tool deployment, talent programmes, and ramp-up execution at the Dholera facility, as outlined in the joint statements.