Introduction: A New Chapter for Indian Semiconductors
Union Budget 2026, presented by Finance Minister Nirmala Sitharaman, has decisively shifted the focus of India's technology ambitions. The announcement of the India Semiconductor Mission 2.0 (ISM 2.0) marks a strategic pivot from merely attracting chip fabrication units to building the entire upstream value chain. This new phase aims to cultivate a robust domestic ecosystem for semiconductor equipment, materials, and design, creating a new set of beneficiaries in India's quest for self-reliance.
Building on the foundation of the ₹76,000 crore ISM 1.0, which focused on establishing chip fabrication and assembly plants, ISM 2.0 widens the scope significantly. "Building on this, we will launch ISM 2.0 to produce equipment and materials, design full-stack Indian IP, and fortify supply chains," the Finance Minister stated, signaling a clear intent to move up the global technology ladder.
A Strategic Shift Beyond Fabs
The core objective of ISM 2.0 is to address the critical gaps in India's electronics ecosystem. While the first phase successfully attracted proposals for foundries and assembly units, the country remains almost entirely dependent on imports for the sophisticated machinery, high-purity chemicals, and specialized materials required to run these facilities. ISM 2.0 is designed to onshore these capabilities, reducing long-term import dependency and enhancing supply chain resilience. This move is crucial for creating sustainable, high-value manufacturing and positioning India as a globally competitive semiconductor hub.
Direct Boost for Equipment and Capital Goods
The budget lays a multi-pronged foundation to support domestic equipment manufacturing. The primary driver is ISM 2.0's explicit goal to "produce equipment." This is further supported by related policy announcements that strengthen the broader capital goods sector. The Finance Minister proposed the establishment of high-tech tool rooms by central public sector enterprises (CPSEs) at two locations. These centers will function as automated service bureaus to locally design, test, and manufacture high-precision components, which are essential for building complex semiconductor machinery. Additionally, a new scheme for construction and infrastructure equipment (CIE) will bolster the domestic manufacturing of technologically advanced machinery, creating a stronger industrial base for all forms of capital goods production.